Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-10-08
1996-02-27
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
437226, 437925, B32B 3118
Patent
active
054945496
ABSTRACT:
In a dicing method, a resin adhesive tape is stuck to one surface of a wafer mount frame, then a rubber plate is stuck to the tape from the open side of the frame. With the rubber plate stretched, an adhesive is sprayed over the rubber plate, whereupon a wafer is stuck to the rubber plate. A weight is placed on the rubber plate to extend it further, thus fixing the wafer to the frame. The thus mounted wafer is diced. Alternatively, a resin adhesive tape is stuck to one surface of the frame, then a thick adhesive rubber plate is stuck to the tape from the open side of the frame, whereupon a wafer with hard wax printed using a screen mask is stuck to the rubber plate. The thus mounted wafer is diced by cutting into it deeply. The cut wafer is soaked in a solvent for separation from the rubber plate. As a further alternative, screen mask printing is carried out on a wafer, and wax is coated over the wafer. A resin adhesive tape is stuck to one surface of a wafer mount frame, and then a thick adhesive rubber plate is stuck to the tape from the open side of the wafer mount frame, whereupon the wax-side surface of the wafer is stuck to the rubber plate. The mounted wafer is diced. The wafer is soaked in a solvent for separation of chips from the rubber plate.
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Japanese Utility Model Laid-Open Publication, Sho 57-200033, Jun. 1956, pp. 323-332.
Miyata Tsuyoshi
Murakami Yoshio
Oki Tetsuro
Mayes M. Curtis
Rohm & Co., Ltd.
Simmons David A.
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