Dicing die-bonding film, method of fixing chipped work and...

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Reexamination Certificate

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C428S464000, C156S289000

Reexamination Certificate

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07449226

ABSTRACT:
The dicing die-bonding film of this invention comprises a pressure-sensitive adhesive layer on a supporting base material and a die-bonding adhesive layer on the pressure-sensitive adhesive layer, wherein a releasability in an interface between the pressure-sensitive adhesive layer and the die-bonding adhesive layer is different between an interface corresponding to a work-attaching region in the die-bonding adhesive layer and an interface corresponding to a part or the whole of the other region, and the releasability of the interface is higher than the releasability of the interface. According to this invention, there can be provided a dicing die-bonding film excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

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