Dicing die-bonding film

Details Dicing die-bonding film Dicing die-bonding film

2007-12-18

2007-12-18

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Alignment marks

C257S620000, C257SE23179, C257SE21596, C257SE21599, C438S110000, C438S113000, C438S458000, C438S114000

Reexamination Certificate

active

11012998

ABSTRACT:
A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is possible to provide a dicing die-bonding film in which in the case a semiconductor wafer and the dicing die-bonding film are stuck onto each other, the position of the die-bonding adhesive layer in the film can be recognized.

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Japanese Office Action issued on the corresponding Japanese Patent Application No. 2003-431690, dated Jan. 18, 2007.

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