Dicing-die bonding film

Details Dicing-die bonding film Dicing-die bonding film

1992-12-30

1994-04-19

Zirker, Daniel

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428355, 428354, 428343, 428202, 428198, B32B 712, C09J 702, H01L 2158

Patent

active

053044185

ABSTRACT:
A dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, the pressure-sensitive adhesive layer having been partly ultraviolet-cured to have cured parts and uncured parts. The film has a well-balanced combination of a holding power for supporting a semiconductor wafer during dicing and release properties for enabling cut chips to be easily released together with the adhesive layer so that even large-sized chips as larger than 10 mm.times.10 mm can easily be picked up.

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patent: 5118567 (1992-06-01), Komiyama et al.
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Jap Pat. Abst JP 60196956-A.

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