Dicing/die bonding adhesion tape

Details Dicing/die bonding adhesion tape Dicing/die bonding adhesion tape

2007-07-17

2007-07-17

Zirker, Daniel (Department: 1771)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S343000, C428S3550RA, C428S3550EP, C428S3550CN, C428S447000, C428S448000

Reexamination Certificate

active

10829150

ABSTRACT:
A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2–2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.

REFERENCES:
patent: 6007920 (1999-12-01), Umehara et al.
patent: 6638607 (2003-10-01), Curcio et al.
patent: 2004/0044132 (2004-03-01), Kozakai et al.
patent: 2004/0068076 (2004-04-01), Kozakai et al.
patent: 2004/0213994 (2004-10-01), Kozakai et al.
patent: 9-67558 (1997-03-01), None
patent: 2984549 (1999-09-01), None
patent: 2002-256236 (2002-09-01), None
Japanese Patent Abstract Publication 08-027239 dated Jan. 30, 1996.

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