Dicing and testing optical devices, including thin film filters

Details Dicing and testing optical devices, including thin film filters Dicing and testing optical devices, including thin film filters

2006-05-16

2006-05-16

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

C438S460000

Reexamination Certificate

active

07045370

ABSTRACT:
A technique for fabricating a plurality of thin film filters (“TFFs”), and other optical devices, from a wafer. A device or TFF wafer is affixed to a carrier having a pattern of notches formed thereon corresponding to a pattern into which the wafer is to be diced to form the TFFs. The notches are sized to allow clearance of a dicing apparatus. The wafer is diced at least partially into the notches to form the TFFs, and the TFFs may be individually optically tested with a light source aligned thereto, while they remain affixed to the carrier. The TFFs are removed from the carrier for operation, and the carrier can be re-used. To facilitate re-use, a releasable adhesive is applied to the wafer and/or the carrier, and the notches receive any excess adhesive when the wafer is being affixed to the carrier.

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