Stock material or miscellaneous articles – Composite – Of addition polymer from unsaturated monomers
Reexamination Certificate
2007-02-27
2007-02-27
Gray, Linda (Department: 1734)
Stock material or miscellaneous articles
Composite
Of addition polymer from unsaturated monomers
C428S041800, C428S064100, C428S344000, C156S248000, C156S257000, C156S268000, C083S875000, C083S880000
Reexamination Certificate
active
10486165
ABSTRACT:
A dicing adhesive sheet having a base film and an adhesive layer formed on the base film is characterized in that the thickness of the adhesive layer ranges from 1 to 10 μm and the adhesive layer has an sticking temperature such that the adhesion measured when 180° peeling at 23° C. of the dicing sheet is conducted (the peeling rate is 300 mm/min) after it is applied to a silicon mirror wafer is 10 N/25 mm or more. In a dicing method using such a dicing adhesive sheet, the production yield of a diced body such as a semiconductor wafer is high, and chipping the dicing is prevented.
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Document for submitting Publication dated Feb. 28, 2006 to Japanese Patent Office.
Gray Linda
Knobbe Martens Olson & Bear LLP
Nitto Denko Corporation
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