Diazo heat-sensitive recording material comprising hydroxy couma

Radiation imagery chemistry: process – composition – or product th – Microcapsule – process – composition – or product

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430156, 430157, 430171, 430172, 430173, 430182, 430183, 430186, G03C 154, G03C 158, G03F 7021

Patent

active

056838506

ABSTRACT:
A diazo heat-sensitive recording material having excellent raw stock storability and image storage characteristics, which comprises a support having thereon a recording layer comprising a diazo compound, a coupling component and an organic base. The diazo compound is a 4-disubstituted amino-2-alkoxybenzenediazonium salt and the coupling component is a compound represented by the following general formula: ##STR1## wherein R.sub.4, R.sub.5, R.sub.6 and R.sub.7 each represents a hydrogen atom, an alkyl group, an aryl group, an aralkyl group, an alkyloxy group, an aryloxy group, an alkylthio group, an arylthio group, an acyl group, an alkoxycarbonyl group, an acyloxy group, a carbamoyl group, a sulfamoyl group, a halogen atom, a cyano group or a nitro group.

REFERENCES:
patent: 4400458 (1983-08-01), Walkow et al.
patent: 4650740 (1987-03-01), Usami et al.
patent: 4895826 (1990-01-01), Watanabe et al.
patent: 5213939 (1993-05-01), Sugiyama et al.
patent: 5296329 (1994-03-01), Sugiyama et al.
patent: 5338642 (1994-08-01), Tanaka et al.

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