Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1991-02-28
1992-07-21
Tolin, Gerald P.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
165 803, 165 804, 357 82, 361386, H05K 720
Patent
active
051328739
ABSTRACT:
An article provides sealing of an electronic component connected to a mating fluid heat exchanger by providing a diaphragm with an opening shaped to fit about the heat exchanger, the opening forming a sealing lip. A clamping ring, which expands and contracts as a function of temperature is placed around the lip of the diaphragm and subject to a temperature to shrink the clamping ring against the lip and heat exchanger for sealing the diaphragm thereto. Preferably the clamping ring is a shape memory alloy metal. In addition, a compressible metal seal may be placed between the lip and the heat exchanger to increase the ability to seal.
REFERENCES:
patent: 3826957 (1974-07-01), McLaughlin et al.
patent: 4037270 (1977-07-01), Ahmann et al.
patent: 4040172 (1977-08-01), Kurtz et al.
patent: 4109707 (1978-08-01), Wilson et al.
patent: 4274106 (1981-06-01), Ohdate
patent: 4381032 (1983-04-01), Cutchaw
patent: 4386362 (1983-05-01), Kessler, Jr. et al.
patent: 4558395 (1985-12-01), Yamada
patent: 4567505 (1986-01-01), Pease et al.
patent: 4612978 (1986-09-01), Cutchaw
patent: 4675475 (1987-06-01), Krumme
patent: 4729060 (1988-03-01), Yamamoto et al.
patent: 4730665 (1988-03-01), Cutchaw
patent: 4748495 (1988-05-01), Kucharek
patent: 4783721 (1988-11-01), Yamamoto et al.
patent: 4800422 (1989-01-01), Sanwo et al.
patent: 4861240 (1989-08-01), Knutti et al.
patent: 4879629 (1989-11-01), Tustaniwskyj
patent: 4933747 (1990-06-01), Schroeder
Blake et al., "Packaging Structure," IBM Technical Disclosure, vol. 21, No. 1, Jun. 1978, pp. 183-184.
Seely, "Combination Cooling System," IBM Technical Disclosure, vol. 11, No. 7, Dec. 1968, pp. 838-839.
Tadaki et al, "Thermal Cycling Effects in an Aged Ni-rich Ti-Ni Shape Memory Alloy," Transactions of the Japan Insttute of Metals, vol. 28, No. 11 (1987), pp. 883-890.
Gupta Omkarnath R.
Herrell Dennis J.
Nelson Richard D.
Microelectronics and Computer Technology Corporation
Tolin Gerald P.
LandOfFree
Diaphragm sealing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Diaphragm sealing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Diaphragm sealing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-849243