Semiconductor device manufacturing: process – Having diamond semiconductor component
Reexamination Certificate
2011-07-19
2011-07-19
Smith, Matthew (Department: 2823)
Semiconductor device manufacturing: process
Having diamond semiconductor component
C257S077000, C257SE21001
Reexamination Certificate
active
07981721
ABSTRACT:
A method of manufacturing a transistor, typically a MESFET, includes providing a substrate including single crystal diamond material having a growth surface on which further layers of diamond material can be deposited. The substrate is preferably formed by a CVD process and has high purity. The growth surface has a root-mean-square roughness of 3 nm or less, or is free of steps or protrusions larger than 3 nm. Further diamond layers are deposited on the growth surface to define the active regions of the transistor. An optional n+ shielding layer can be formed in or on the substrate, following which an additional layer of high purity diamond is deposited. A layer of intrinsic diamond may be formed directly on the upper surface of the high purity layer, followed by a boron doped (“delta doped”) layer. A trench is formed in the delta doped layer to define a gate region.
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Kohn Erhard
Scarsbrook Geoffrey Alan
Schwitters Michael
Twitchen Daniel James
Wort Christopher John Howard
Diamond Microwave Devices Limited
Fan Michele
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Smith Matthew
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