Diamond-silicon hybrid integrated heat spreader

Details Diamond-silicon hybrid integrated heat spreader Diamond-silicon hybrid integrated heat spreader

2005-08-02

2005-08-02

Potter, Roy (Department: 2822)

Semiconductor device manufacturing: process

Having diamond semiconductor component

C165S185000

Reexamination Certificate

active

06924170

ABSTRACT:
An electronic device includes a die further having a first major surface, and a second major surface. The electronic device also includes a plurality of connectors associated with the first major surface of the die, and an integrated heat spreader in thermally conductive relation with the second major surface of the die. The integrated heat spreader also has a layer of silicon, and a layer of diamond attached to the layer of silicon. The first major surface of the die attached to a printed circuit board. A method for forming a heat dissipating device includes placing a layer of diamond on a silicon substrate, and thinning the silicon substrate. The substrate is diced to form a plurality of heat dissipating devices sized to form a thermally conductive connection to a die. A surface of the silicon substrate is placed in thermal communication with a source of heat.

REFERENCES:
patent: 5354717 (1994-10-01), Pollock et al.

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