Diamond heatsink assemblies

Details Diamond heatsink assemblies Diamond heatsink assemblies

1986-02-21

1987-03-17

Davis, Jr., Albert W.

Heat exchange

Heat transmitter

165 801, 357 81, F28F 700

Patent

active

046499920

ABSTRACT:
A diamond heatsink assembly for small electronic components such as microwave or millimetric wave devices comprises a frusto-conical shaped diamond held on a support by a clamping member with a part-conical hole through it. One or both of the support and the clamping member are made of a high thermal conductivity metal such as gold, silver, copper or aluminum. The clamping member may be secured to the support by soldering, friction welding, a screw thread or any other suitably tight clamping method. The diamond, the support and the clamping member may be metallized to reduce electrical skin resistance. The arrangement is an improvement on diamond heatsinks in which a diamond is simply bonded to the support by soldering or brazing and heatsinks in which the diamond is pressed into the surface of the support.

REFERENCES:
patent: 3678995 (1972-07-01), Collard
patent: 3828848 (1974-08-01), Custer et al.
patent: 3872496 (1975-03-01), Potter
patent: 3949263 (1976-04-01), Harper
patent: 4576224 (1986-03-01), Eaton et al.

Affiliated with

Also associated with

Rating

Diamond heatsink assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Diamond heatsink assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Diamond heatsink assemblies will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1782480