Diamond-containing ceramic composites and methods of making same

Details Diamond-containing ceramic composites and methods of making same Diamond-containing ceramic composites and methods of making same

1988-08-15

1993-06-01

Brunsman, David

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 99, 501154, C03C 1400

Patent

active

052159426

ABSTRACT:
Diamond-containing ceramic composites useful as substrates and the like in the electronics industry as well as for abrasive and cutting applications and methods of making same are disclosed. More specifically, the sol-gel process is used to fabricate the composites by combining water, an organometallic precursor compound, alcohol or similar solvent between the water and the precursor compound, a catalyst, diamond powder and a thickening agent to form a moldable, wet, porous gel which can be dried at a temperature below the boiling point of any of the gel liquids to form a stabilized porous composite. The stabilized porous composite can be densified, by heat, in an essentially oxygen-free atmosphere to form a diamond-containing ceramic composite having low porosity.

REFERENCES:
patent: 4377507 (1983-03-01), Pope et al.
patent: 4680048 (1987-07-01), Motoki et al.
patent: 4681615 (1987-07-01), Toki et al.
patent: 4695321 (1987-09-01), Akashi et al.
patent: 4710227 (1987-12-01), Harley et al.
Yoldas, "Preparation of Glasses and Ceramics from Metal-Organic Compounds", J. Mat. Sci. 12(1977), pp. 1203-1208.

Affiliated with

Also associated with

Rating

Diamond-containing ceramic composites and methods of making same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Diamond-containing ceramic composites and methods of making same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Diamond-containing ceramic composites and methods of making same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1814200