Diamond composite heat sink for use with semiconductor devices

Details Diamond composite heat sink for use with semiconductor devices Diamond composite heat sink for use with semiconductor devices

1988-10-11

1991-04-16

Jackson, Jr., Jerome

Chemistry of inorganic compounds

Oxygen or compound thereof

Metal containing

423446, 165905, H01L 2336

Patent

active

050087371

ABSTRACT:
A composite comprised of diamond particles embedded in a metal matrix is a highly satisfactory heat sink material for use with a semiconductor.

REFERENCES:
patent: 3969754 (1976-07-01), Kumiya et al.
patent: 4239502 (1980-12-01), Slack
patent: 4412480 (1983-11-01), Tsuji et al.

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