Diamond composite heat sink for use with semiconductor devices

Details Diamond composite heat sink for use with semiconductor devices Diamond composite heat sink for use with semiconductor devices

1990-11-05

1992-07-14

Jackson, Jr., Jerome

Chemistry of inorganic compounds

Oxygen or compound thereof

Metal containing

423466, 165905, H01L 2336

Patent

active

051307715

ABSTRACT:
A heat sink for a semiconductor component of a heat-dissipating and light-radiating semiconductor electronic device. Diamond particles are embedded in a metal matrix to form a composite having a coefficient of thermal expansion which is substantially that of the semiconductor component of the electronic device.

REFERENCES:
patent: 4412980 (1983-11-01), Tsuji
patent: 4482912 (1984-11-01), Chiba et al.
patent: 4569692 (1986-02-01), Butt
patent: 4948388 (1990-08-01), Ringwood
Loeffel et al., IBM TDB vol. 21, No. 6, Nov. 1978, "Heat Transfer . . . Chip", p. 2430.

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