Diamond compact for a wire drawing die and a process for the pro

Details Diamond compact for a wire drawing die and a process for the pro Diamond compact for a wire drawing die and a process for the pro

1981-01-23

1983-01-25

Thurlow, Jeffery R.

Abrasive tool making process, material, or composition

With inorganic material

Metal or metal oxide

51307, 72146, 76107A, B24D 302

Patent

active

043701493

ABSTRACT:
This invention relates to a diamond compact for a wire drawing die, which comprises 70 to 95% by volume of diamond powder with a particle size of at most 50 microns and the balance of a binder phase consisting of a carbide of WC or (Mo, W)C with a particle size of at most 1 micron and an iron group metal, the carbide and iron group metal in the binder phase being in such a proportion by weight that the content of the carbide is more than that corresponding to the eutectic composition.

REFERENCES:
patent: 4212671 (1980-07-01), Ettmayer
patent: 4215999 (1980-08-01), Phaal
patent: 4231762 (1980-11-01), Hara et al.
patent: 4268276 (1981-05-01), Bovenkerk

Affiliated with

Also associated with

Rating

Diamond compact for a wire drawing die and a process for the pro does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Diamond compact for a wire drawing die and a process for the pro, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Diamond compact for a wire drawing die and a process for the pro will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1622287