Diamond-coated member and process for the preparation thereof

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4272481, 4272552, 428408, 428457, B32B 904, B32B 1504, C23C 1600

Patent

active

051358077

DESCRIPTION:

BRIEF SUMMARY
DESCRIPTION



Technical Field

The present invention relates to a diamond-coated member and a process for the preparation of the diamond-coated member and, more particularly, to a diamond-coated member which can appropriately be used for tools and various members, such as various super hard tools, abrasion resistant tools and so on, e.g., cutting tools, which require a high degree of hardness and abrasion resistance and to a process for the preparation of the diamond-coated member.


Background Technology

Heretofore, super hard alloys, sintered diamond, single crystal diamond and so on have been used for tools, such as cutting tools, abrasive tools, super hard tools, e.g., dies, abrasion resistant tools and so on, which require a high degree of hardness and abrasion resistance.
Among these, a so-called diamond tool using a diamond is particularly preferred due to its remarkably excellent hardness, abrasion resistance and so on.
Heretofore, the diamond tools are constructed such that a sintered diamond or a single crystal diamond is fixed, for example, by brazing or the like, on the surface of the member such as a super hard alloy or a high hard metal.
On the other hand, recent years, extensive review has been made on the preparation of the diamond-coated members by means of the diamond synthesis technology based on vapor phase method such as CVD method, PVD method or the like, thereby forming a diamond film on the base material such as super hard alloys or high hard metals, and attempts have been made to apply those diamond-coated members to the uses as described hereinabove.
It is to be noted herein that diamond is the hardest substance and it is remarkably superior to other substances in many respects, such as abrasion resistance, heat resistance, thermal conductivity, chemical resistance, radiation resistance and so on, so that the diamond film to be formed on the surface of the base material such as the super hard alloys, sintered ceramics and so on is considered capable of being utilized effectively as a coating member for providing the base materials with a high degree of hardness, abrasion resistance and so on, as a protective film for various base materials, and so on.
For example, the formation of the diamond film of a sufficiently thick film thickness on the surface of the base material such as the super hard alloy to be used for the super hard tools such as cutting tools, abrasive tools and so on can provide super hard tools with further improved performance.
It can be noted, however, that the surface of the super hard alloy is usually poor in adhesion to the diamond film to be deposited by usual vapor phase synthesis method and, in particular, that an increasingly thicker film thickness of the diamond film further reduces the adhesion, thereby resulting in the likelihood to cause separation of the diamond film from the base material, or the like, and so far providing no commercially valuable tool. Therefore, a great deal of improvement in adhesion and so on has been desired.
Hence, technology has been proposed which forms an intermediate layer between the super hard alloy and the diamond film in order to improve adhesion between the surface of the super hard alloy and the diamond.
For example, Japanese Patent Unexamined Publication (kokai) No. 58(1983)-126,972 discloses a super hard alloy with a diamond film deposited by forming an intermediate layer comprising one member or more selected from a carbide, a nitride, a boride and an oxide of a metal belonging to the group IVa, Va or VIa on the surface of the super hard alloy and thereafter by forming the diamond film on the resulting intermediate layer.
However, the method as disclosed in the above patent publication is stated such that the disposition of the intermediate layer improves the adhesion, however, the adhesion is still insufficient and there are problems that in particular when the film thickness of the diamond film is increased, the adhesion is so reduced that the diamond film is likely to come off, etc., and this method does not y

REFERENCES:
patent: 4707384 (1987-11-01), Schachner et al.
Patent Abstracts of Japan, vol. 13, No. 101, Mar. 9, 1989; JP-A-63 277 593.
Patent Abstracts of Japan, vol. 11, No. 361, Nov. 25, 1987; JP-A-62 133 068.
Patent Abstracts of Japan, vol. 12, No. 421, Nov. 8, 1988; JP-A-63 153 275.

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