Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil
Reexamination Certificate
1998-04-06
2001-01-30
Gellner, Michael L. (Department: 2832)
Inductor devices
Coil or coil turn supports or spacers
Printed circuit-type coil
C336S223000, C336S232000
Reexamination Certificate
active
06181231
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates generally to a method and apparatus for transferring heat from electrical circuit devices. The present invention relates to the use of diamond in electrical circuit devices to provide electrical insulation as well as heat transfer from the electrical devices.
BACKGROUND OF THE INVENTION
Many electrical devices are constructed from a plurality of electrically conductive layers separated by one or more layers of electrical insulation material. For example, a capacitor is basically two metal plates separated by a layer of an electrically insulative material. In some instances, the electrically insulative material is air. In other instances, an actual electrically insulative material, such as Kapton or a similar material is used. Similarly, transformers include coils of wires that conduct electricity. A non-thermally conductive insulation material is placed around each wire in the coil to prevent individual wires in the coil from “shorting”. The insulation layer prevents the flow of heat from the center of the transformer. This causes high core temperatures and reduced product life.
High temperatures can cause failure of an electrical component or reduced product life. Excessive operating temperatures can cause degradation of the insulation thereby enabling a short to develop between conductors previously separated by an insulative layer. As a result, there is always a need for an apparatus or material which can carry away heat, or cool, an electrical component and do it more efficiently. In the case of layered electrical devices such as transformers, inductors and capacitors, there is a need for a material that provides superior thermal transport and superior resistance to electrical current flow.
Smaller components are a constant goal of the electronics industry. Smaller components cost less and also result in smaller system packages. If a material and method that allows for more efficient dissipation of heat can be used, smaller amounts of that material need to be present to carry away the same amount of heat. Therefore, smaller components can be made. Electrical transformers can now be made in layers. The layers of the transformer are separated by an insulative material. If the insulative material is more effective at transferring heat, a thinner layer of insulative material can be used in forming the transformer. Thinner layers also result in lower core losses.
One way of building a multiple-device electronic component is to populate a common substrate with individual electrical components. In other words, discrete electrical components are attached to a substrate. Other electrical components, like capacitors or traditional transformers having coils wound about a core, mount directly to a substrate. The area of the substrate adjacent the electrical component may not be exposed to an ambient environment. The portion of the substrate next to the component may heat, causing the temperature to rise and possibly resulting in a failure. Thus, there is also a need for a material and method for making a substrate that efficiently removes heat from the individual components and delivers it to the chosen thermal “sink.”
SUMMARY OF THE INVENTION
An electronic packaging concept includes mounting one or more electronic components to a substrate including a layer of diamond. The layer of diamond is in sufficient volume to transfer heat from the one or more electronic components attached to the diamond substrate. The entire substrate can also be made of diamond. Diamond is unique in that is a good electrical conductor as well as a good thermal conductor. As a result, the number of electrical components that can be mounted on such a substrate can be increased and the heat produced will be carried away more efficiently when compared to substrates made from other electrically insulative materials. Using such a substrate eliminates the need for added fins on some components and would allow for a much more densely packed set of components when compared to substrates made from other electrically insulative materials.
In addition to a diamond layer as a substrate, diamond can also be used in an electrical apparatus which can be constructed in multi-layer fashion. The layering includes alternate layers of patterned metallization (an electrical conductor) and diamond (a thermal conductor and electrical insulator). The apparatus can be a capacitor, an inductor, or a transformer. In a transformer, the patterned metallization for a transformer results in a first coil and a second coil. A first electrical conductor pattern forms the first coil and the second electrical conductor pattern forms the second coil. The first electrical conductor is formed in a plurality of layers. Metal patterns are formed on a layer to make an electrical path around a core of ferrous material. The second conductor forms a second coil of the transformer and also wraps around the core of ferrous material. Using diamond is advantageous in a transformer since the diamond is very effective at transferring heat from the core of the transformer. The diamond also electrically insulates the various portions of the transformer. Because of the great thermal conductive characteristics, smaller transformers can be built since less material is needed to effectively remove heat from the core of the transformer.
An appreciation of other aims and objectives of the present invention and a more complete and comprehensive understanding of this invention may be achieved by studying the following description of a preferred embodiment and by referring to the accompanying drawings.
REFERENCES:
patent: 4123736 (1978-10-01), Bougham
patent: 4342143 (1982-08-01), Jennings
patent: 4665357 (1987-05-01), Herbert
patent: 4845606 (1989-07-01), Herbert
patent: 4897916 (1990-02-01), Blackburn
patent: 4942353 (1990-07-01), Herbert et al.
patent: 4978906 (1990-12-01), Herbert et al.
patent: 5093646 (1992-03-01), Herbert
patent: 5126714 (1992-06-01), Johnson
patent: 5479146 (1995-12-01), Herbert
patent: 5481238 (1996-01-01), Carsten et al.
patent: 5555494 (1996-09-01), Morris
patent: 5598327 (1997-01-01), Sommverville et al.
patent: 5773870 (1998-07-01), Su et al.
patent: 5777539 (1998-07-01), Folker et al.
patent: 5781093 (1998-07-01), Grandmont et al.
patent: 5844461 (1998-12-01), Faulk et al.
“Introduction to Transformer”, In:Magnetic Circuits, Transformers, and Three-Phase Circuits,589-598, (No Date Given).
“Transformers”,Precision Incorporated,Chapter 22, 581, (No Date Given).
Gellner Michael L.
Mai Anh
Schwegman, Landberg, Woessner & Kluth, P.A.
Silicon Graphics Inc.
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