Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Patent
1997-08-14
1999-10-12
Kincaid, Kristine
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
174260, 361818, 361820, H05K 900
Patent
active
059658436
ABSTRACT:
An injection-molded part (1) includes elevations (2) and/or depressions (12) arranged between integrated printed conductors (4). If the elevations (2) or depressions (12) are uncoated and thus electrically insulating, they increase the effective voltage clearances between the printed conductors (4) and the components (3) arranged next to the printed conductors (4). The geometric distances can then be reduced. Alternatively, by electroconductively coating the elevations (2), electric and magnetic shielding is achieved in a simple manner. A cover (6) is provided as a top of a box which uses elevations (2) as side walls. A tapering portion (5) connects coatings (7,7') of the cover (6) and elevations (2) via a printed conductor (8) running diagonally across the tapering portion (5).
REFERENCES:
patent: 3365621 (1968-01-01), Von Fange et al.
patent: 3721746 (1973-03-01), Knappenberger
patent: 4759466 (1988-07-01), Chase et al.
patent: 4837664 (1989-06-01), Rodriguez, II et al.
patent: 4860162 (1989-08-01), DeVizzi
patent: 4861941 (1989-08-01), Kubo et al.
patent: 5045971 (1991-09-01), Ono et al.
patent: 5105095 (1992-04-01), Rudy, Jr. et al.
patent: 5107404 (1992-04-01), Tam
patent: 5150282 (1992-09-01), Tomura et al.
patent: 5229545 (1993-07-01), Good
patent: 5252782 (1993-10-01), Cantrell et al.
patent: 5271887 (1993-12-01), Wiech, Jr.
patent: 5285010 (1994-02-01), Huber
patent: 5297007 (1994-03-01), Deyo et al.
patent: 5407622 (1995-04-01), Cleveland et al.
patent: 5422433 (1995-06-01), Rivera et al.
patent: 5432676 (1995-07-01), Saloh et al.
patent: 5451722 (1995-09-01), Gregoire
patent: 5523921 (1996-06-01), Van Lydegraf
patent: 5604668 (1997-02-01), Wohrstein et al.
patent: 5706170 (1998-01-01), Glovatsky et al.
Gruber Stefan
Kasowski Hermann
Schmidt Heinz
Schonberger Eduard
Cuneo Kamand
Kincaid Kristine
Siemens AG
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