Dewall plating technique

Details Dewall plating technique Dewall plating technique

1991-11-04

1994-01-25

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361784, 257528, H05K 100

Patent

active

052817695

ABSTRACT:
A new design concept is presented and demonstrated for the fabrication of active and passive components in integrated circuit (IC) devices for microwave signal transmission. High circuit packing density is desirable but the current configurations of the conventional flat strip type conductors present physical limitations to achieving such an objective. The new conductor configuration not only overcomes such circuit packing problems of the conventional line design, but provides additional improvements in performance parameters, such as lower circuit resistance and lower parasitic interactions; an ability to fabricate circuits to design specifications and to improve reliability at low cost. The new concept has been applied to the fabrication of transmission lines, capacitors, inductors, air bridges and to formulating the fabrication steps for a FET. Polyimide film enables an improved fabrication step to be performed in the invention, and a new processing technique for polyimide material has also been demonstrated.

REFERENCES:
patent: 3674914 (1972-07-01), Burr
patent: 3913219 (1975-10-01), Lichtblau
Japanese Abstract, vol. 12, No. 55 (M669) (2902) published Feb. 19, 1988.
European Search Report No. EP 91 11 8902.

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