Devices for dissipating heat in a fluid ejector head and...

Details Devices for dissipating heat in a fluid ejector head and... Devices for dissipating heat in a fluid ejector head and...

2005-06-21

2005-06-21

Meier, Stephen D. (Department: 2853)

Incremental printing of symbolic information

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Reexamination Certificate

active

06908170

ABSTRACT:
A fluid ejector assembly includes a container that stores a fluid to be ejected, a heat sink attached to the container, and a die module bonded to the heat sink. The heat sink is molded from a polymer that has at least one thermally conductive filler material mixed into the polymer. The heat sink is shaped to dissipate heat. The fluid ejector assembly is manufactured by mixing the at least one thermally conductive filler material with the polymer, molding the heat sink using the polymer and thermally-conductive filler material mixture, and attaching the heat sink to a die module and, optionally, to a fluid-containing container.

REFERENCES:
patent: 5506608 (1996-04-01), Marler et al.
patent: 6076912 (2000-06-01), Murthy
patent: 6343848 (2002-02-01), Berg et al.
patent: 6844054 (2005-01-01), Whatley
patent: 2003/0064508 (2003-04-01), Kwasnoski et al.
patent: 02187350 (1990-07-01), None

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