Devices for and methods of mounting integrated circuit packages

Details Devices for and methods of mounting integrated circuit packages Devices for and methods of mounting integrated circuit packages

1982-09-20

1985-08-27

Rosenbaum, Mark

Metal working

Method of mechanical manufacture

Electrical device making

29740, 339 17CF, H05K 334, B23P 1900

Patent

active

045369550

ABSTRACT:
The device incorporates a support member (1) for the circuit package (13); a plurality of contact elements (4) for connection with the conductive terminations mounted on the support member each of the contact elements being resiliently biassed away from its associated conductive terminations (16) and means (12) for selectively exerting pressure upon the contact elements so as to urge them into contact with their associated conductive terminations to facilitate soldering and after such soldering to facilitate the removal of the circuit package (13) if and when desired, by allowing the pressure to be removed so that on de-soldering the resilient loading on a contact (4) will cause it automatically to spring away from the associated conductive terminations.

REFERENCES:
patent: 3588618 (1971-06-01), Otte
patent: 3753211 (1973-08-01), Pauza et al.
patent: 3905098 (1975-09-01), Garretson et al.
patent: 4155615 (1979-05-01), Zimmerman, Jr. et al.
patent: 4375309 (1983-03-01), Griffin

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