Devices containing aluminum-V semiconductor and method for makin

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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357 16, 357 52, 204 56R, 204 38A, 204 35R, 204 42, 204 35N, 204 37R, 204 32S, 136 89, H01L 2714

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active

039822656

ABSTRACT:
A high efficiency solar cell having n-type aluminum arsenide grown on a p-type gallium arsenide substrate and protected by a layer of anodic oxide. The aluminum arsenide is deposited by vapor phase epitaxy by reacting high purity arsine, hydrogen chloride and aluminum at approximately 1000.degree.C in an all-alumina reactor tube system. The aluminum arsenide layer is protected from deterioration by first anodizing it in pure water and phosphoric acid at pH 2.0 with a current density of 2-8 milliamperes per square centimeter at room temperature. Second, the anodic oxide so formed is annealed at about 450.degree.C for at least twenty minutes in dry nitrogen. The oxide layer also acts as an antireflective coating. A portion of the oxide layer is etched away to expose a region of the aluminum arsenide to which an electrical contact is applied. The other contact is made to the substrate.

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