Device transfer techniques for thin film optoelectronic devices

Details Device transfer techniques for thin film optoelectronic devices Device transfer techniques for thin film optoelectronic devices

2005-11-22

2005-11-22

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C438S957000

Reexamination Certificate

active

06967115

ABSTRACT:
A method for fabricating optoelectronic devices is disclosed. A sacrificial layer is deposited, formed or attached to a target substrate having a plurality of through holes. One or more device layers are formed on the sacrificial layer and the sacrificial layer is exposed to an etchant through the holes in the target substrate to detach the target substrate from the sacrificial layer without destroying the target substrate.

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