Device panel with in-molded applique

Details Device panel with in-molded applique Device panel with in-molded applique

1996-01-11

1998-02-24

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electrical power distribution systems and devices

200296, 200512, 361792, H02B 104

Patent

active

057216665

ABSTRACT:
A molded electrical circuit assembly is disclosed where the molded electrical circuit assembly comprises a device assembly overlaying at least a portion of a face applique and a backing assembly overlaying at least a portion of the device assembly. The device assembly is retained between the face applique and the backing assembly, and the backing assembly has a window formed proximate to the device assembly. Also included is a molded portion molded generally over the backing assembly and abutting at least a portion of the face applique.

REFERENCES:
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patent: 4028509 (1977-06-01), Zurcher
patent: 4145584 (1979-03-01), Otterlei
patent: 4387127 (1983-06-01), Ogden
patent: 4804569 (1989-02-01), Arisawa
patent: 4917927 (1990-04-01), Sakaitani et al.
patent: 5264172 (1993-11-01), Rosica et al.
patent: 5280146 (1994-01-01), Inagaki et al.
patent: 5285038 (1994-02-01), Asher et al.
patent: 5430266 (1995-07-01), Austin, Jr. et al.
patent: 5453586 (1995-09-01), Stottmann
patent: 5574623 (1996-11-01), Girard

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