Device package with hermetically sealed cap and device...

Details Device package with hermetically sealed cap and device... Device package with hermetically sealed cap and device...

2005-08-16

2005-08-16

Williams, Joseph (Department: 2879)

Electric lamp or space discharge component or device manufacturi

Process

With assembly or disassembly

C445S024000, C445S025000

Reexamination Certificate

active

06929523

ABSTRACT:
In a device encapsulation method, an organic EL device is formed on a substrate. An encapsulation cap is placed on the substrate to surround the device and thereafter an end face of the cap is welded on at least the substrate. A device package is also disclosed.

REFERENCES:
patent: 59-129447 (1984-07-01), None
patent: 61-48697 (1986-04-01), None
patent: 08-330352 (1996-12-01), None

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