Device package with a thermoplastic encapsulation cap and...

Details Device package with a thermoplastic encapsulation cap and... Device package with a thermoplastic encapsulation cap and...

2007-05-29

2007-05-29

Williams, Joseph (Department: 2879)

Electric lamp and discharge devices

With luminescent solid or liquid material

Solid-state type

C313S506000

Reexamination Certificate

active

10953351

ABSTRACT:
In a device encapsulation method, an organic EL device is formed on a substrate. An encapsulation cap is placed on the substrate to surround the device and thereafter an end face of the cap is welded on at least the substrate. A device package is also disclosed.

REFERENCES:
patent: 59-129447 (1984-07-01), None
patent: 61-48697 (1986-04-01), None
patent: 08-330352 (1996-12-01), None

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