Device mounting a semiconductor element on a wiring substrate an

Details Device mounting a semiconductor element on a wiring substrate an Device mounting a semiconductor element on a wiring substrate an

1999-02-10

2000-05-16

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438106, 438110, 438119, H01L 2144, H01L 2148, H01L 2150

Patent

active

060636491

ABSTRACT:
Two kinds of first and second adhesive components 8a, 8b are used to a joining treatment for connecting a protruded electrode 6 of a semiconductor element 5 and a substrate wiring 3 of a wiring substrate 1. The first adhesive component 8a is at a central portion on the surface of the semiconductor element 5 to be joined with the wiring substrate, in which the first adhesive component 8a is formed, and the second adhesive component 8b is disposed in a region at the periphery thereof having the protruded electrode 6. Further, the cure-shrinkage of the first adhesive component 8a is made greater than that of the second adhesive resin 8b and the modulus of elasticity of the second adhesive component 8b is made greater than that of the first adhesive component 8a such that the thermal expansion of the second adhesive component 8b in the high temperature circumference does not exceeds the cure-shrinkage during curing of the first adhesive 8a. Further, the curing temperature of the first adhesive component is made lower than that of the second adhesive component.

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