Device, method of manufacture thereof, manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

Reexamination Certificate

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Details

C257SE23166, C349S149000

Reexamination Certificate

active

10849858

ABSTRACT:
A device includes banks formed on a substrate, a conducting film formed by droplet ejection onto a predetermined pattern formation region in a groove between the banks, and a second conductive film formed by droplet ejection disposed outside the pattern formation region and electrically separated from the conductive film.

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