Device, method and program for soldering

Details Device, method and program for soldering Device, method and program for soldering

2007-12-04

2010-10-05

DeCady, Albert (Department: 2121)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S114000, C700S207000, C700S210000, C700S299000, C219S255000, C219S388000, C219S422000, C218S008000

Reexamination Certificate

active

07809465

ABSTRACT:
Soldering can be performed in a state where the temperature in an object zone is stable, regardless of the heat capacity of a soldering object. A soldering device includes: a position calculation unit which calculates the position of a heated object according to operational information of a conveyer which sequentially transfers the heated object into a plurality of zones for heat processing communicated with each other; a heat capacity calculation unit which calculates the heat capacity of the heated object; and a temperature management unit which controls the temperature in an object zone into which the heated object is carried, upon receiving positional information from the position calculation unit. The temperature management unit feedforward-controls the temperature in the object zone by adjusting the heat capacity of the object zone according to the heat capacity calculated by the heat capacity calculation unit.

REFERENCES:
patent: 6018144 (2000-01-01), Vogt et al.
patent: 6135344 (2000-10-01), Sakuyama et al.
patent: 6345757 (2002-02-01), Sakuyama et al.
patent: 6453219 (2002-09-01), Kazmierowicz et al.
patent: 6560514 (2003-05-01), Schultz et al.
patent: 6606537 (2003-08-01), Kazmierowicz et al.
patent: 7493242 (2009-02-01), Garcia
patent: 2003/0020928 (2003-01-01), Ritzdorf et al.
patent: 2005/0121495 (2005-06-01), Yokoyama
patent: 2006/0054667 (2006-03-01), Onozaki et al.
patent: 2007/0158387 (2007-07-01), Shirai et al.
patent: 2007/0181218 (2007-08-01), Sakamoto et al.
patent: 1-147281 (1989-06-01), None
patent: 2000-277905 (1990-10-01), None
patent: 4-371365 (1992-12-01), None
patent: 9-74270 (1997-03-01), None
Morimoto et al., An Apparatus for Specific Heat Capacity Measurement by Thermal Radiation Calorimetry, International Journal of Thermophsics, vol. 20, No. 2, 1999.
English language Abstract of JP 1-147281.
English language Abstract of JP 4-371365.
English language Abstract of JP 9-74270.
English language Abstract of JP 2000-277905.

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