Device manufacturing method and lithographic apparatus

Photocopying – Projection printing and copying cameras – Step and repeat

Reexamination Certificate

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C355S067000

Reexamination Certificate

active

08049864

ABSTRACT:
A device manufacturing method includes a measurement phase and an exposure phase. The measurement phase includes conditioning a radiation beam with a first beam condition, forming the patterned radiation beam by imparting the radiation beam with the first beam condition with a first pattern in its cross-section, and projecting the patterned beam onto a sensor capable of providing a sensor output signal. The exposure phase includes fast switching the conditioning of the radiation beam to a second beam condition, the second beam condition being different from the first beam condition, forming the patterned radiation beam by imparting the radiation beam with the second beam condition with a second pattern in its cross-section, the second pattern being provided by a patterning device, and projecting the patterned beam onto a target portion of the substrate.

REFERENCES:
patent: 6737662 (2004-05-01), Mulder et al.
patent: 7268890 (2007-09-01), Emer
patent: 7308368 (2007-12-01), Kok et al.
patent: 2007/0081138 (2007-04-01), Kerkhof et al.
patent: 11-003849 (1999-01-01), None
patent: 2003-022967 (2003-01-01), None
patent: 2003-318090 (2003-11-01), None
patent: 2006-114888 (2006-04-01), None
patent: 2007-110116 (2007-04-01), None
patent: 2009-105417 (2009-05-01), None
Mark van de Kerkhof et al., “Full optical column characterization of DUV lithographic projection tools”, in Proceedings of the SPIE, vol. 5377, pp. 1960-1970 (2004).
English language Abstract of Japanese Patent Publication No. 11-003849 A, published Jan. 6, 1999; 1 page.
English language Abstract of Japanese Patent Publication No. 2003-022967 A, published Jan. 24, 2003; 1 page.
English language Abstract of Japanese Patent Publication No. 2003-318090 A, published Nov. 11, 2003; 1 page.
English language Abstract of Japanese Patent Publication No. 2006-114888 A, published Apr. 27, 2006; 1 page.
English language Abstract of Japanese Patent Publication No. 2007-110116 A, published Apr. 26, 2007; 1 page.
English language Abstract of Japanese Patent Publication No. 2009-105417 A, published May 14, 2009; 1 page.
English translation of Japanese Notice Reasons for Rejection directed to related application No. 2008-323014, mailed Jun. 17, 2011 from the Japanese Patent Office; 3 pages.

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