Device isolation area structure in semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

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257 52, 257501, 257505, 257507, 257519, 257349, H01L 2704, H01L 2701, H01L 2712, H01L 2713

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active

054364957

ABSTRACT:
A device isolation area structure in a semiconductor device is composed of two layers of a first device isolation film formed by selectively oxidizing a surface of a silicon substrate, and a second device isolation region formed in a single crystal silicon film covering the first device isolation film. A guard band region may be formed within the semiconductor substrate and immediately below the first device isolation film so as to be in contact with the first device isolation film. The device isolation area structure is suitable to high integration of the semiconductor device and provides less possibilities of occurrence of crystal defects.

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