Device inspecting for defect on semiconductor wafer surface

Details Device inspecting for defect on semiconductor wafer surface Device inspecting for defect on semiconductor wafer surface

2006-04-04

2006-04-04

Stafira, Michael P. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S237500

Reexamination Certificate

active

07023541

ABSTRACT:
An inspection device inspecting for a defect of a semiconductor wafer based on an image of the wafer surface includes an imaging device obtaining image data of a wafer subjected to inspection, a storage circuit storing reference image data of the wafer, an image comparison unit comparing the image data of the wafer subjected to inspection and the reference image data using an inspection condition, an acquiring circuit acquiring wafer in process (WIP) data of the wafer subjected to inspection, and a WIP data operating unit setting the inspection condition based on the WIP data obtained.

REFERENCES:
patent: 6408219 (2002-06-01), Lamey et al.
patent: 2001/0051836 (2001-12-01), Lamey et al.
patent: 2002/0027653 (2002-03-01), Shibata et al.
patent: 2002-100660 (2002-04-01), None

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