Device header and method of making same

Details Device header and method of making same Device header and method of making same

1987-10-15

1988-07-26

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 384, 204 385, C25D 502

Patent

active

047598298

ABSTRACT:
A device header with a multilayer coating overlying its entire surface, and a method of making said header, are disclosed. The multilayer coating comprises an electrolytic nickel layer and a gold layer in the device mounting area of the header, whereas the rest of the header is coated with electroless nickel, a first gold layer, electrolytic nickel, and a second gold layer. In the fabrication, the electroless nickel layer is deposited over the entire header followed by the first gold layer. Upon removing these layers from the device mounting area, the first gold layer remaining on the rest of the header acts as a mask for the etching of the mounting area preparatory to deposition of electrolytic nickel and the second gold layer. The header has the advantage of the excellent coverage of electroless nickel over most of its surface, but with the advantage of high purity electrolytic nickel in the device mounting area.

REFERENCES:
patent: 3828425 (1974-08-01), Manus
patent: 3860949 (1975-01-01), Stoeckert et al.
patent: 3869702 (1975-03-01), Backhouse et al.
patent: 4394679 (1983-07-01), Hawrylo

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