Device having a multi-layered conductor structure

Details Device having a multi-layered conductor structure Device having a multi-layered conductor structure

1992-12-09

1994-03-22

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174257, H05K 100

Patent

active

052966534

ABSTRACT:
A multi-layered conductor structure device has a substrate, a first conductor layer formed on the substrate, which provides an electrode or wiring, and an insulating film covering the first conductor layer and the substrate. On the insulating film, a second conductor layer is formed which comprises an indium tin oxide, and which provides an electrode or wiring. The first conductor layer is formed of an alloy of aluminum with copper, gold, boron, bismuth, cobalt, chromium, germanium, iron, molybdenum, niobium, nickel, palladium, platinum, tantalum, titanium, tungsten, and/or silver.

REFERENCES:
patent: 4094059 (1978-06-01), Tachikawa et al.
patent: 5006054 (1991-04-01), Nikkola
patent: 5026273 (1991-06-01), Cornelison
patent: 5162933 (1992-11-01), Kabeuda et al.

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