Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-01-30
2000-10-03
Tolin, Gerald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361719, H05K 720
Patent
active
061281891
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The invention relates to a device for dissipation of the thermal power loss of an electronic or electromechanical component as generically defined by the preamble to the main claim. Such devices, in which individual power components are joined to heat sinks especially provided for them are already known. For example, the power components are pressed against the heat sinks via retention springs in order to assure an adequate contact pressure. However, this requires special retaining and cooling components and separation production steps in assembly.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide a device for withdrawal of thermal power loss of electrical or electrical components, which avoids the disadvantages of the prior art.
In keeping with these objects and with others which will become apparent hereinafter, one feature of the present invention resides, briefly stated, in the device of the above mentioned general type in which the components have a heat-conducting connection with a metal-coated surface of a printed circuit board, and the coated surface portions protrude as far as the inside of at least one connecting segment of a housing that entirely or partially surrounds the printed circuit board, and that the at least one connecting segment of the housing is located facing the printed circuit board and is embodied in crowned fashion on its surface in such a way that a durable contact pressure is exerted between the housing and the printed circuit board as a result of the deformation of the crowned surface.
When the device is designed in accordance with the present invention, it is advantageous in that, in a simple way the housing takes on the function of the heat sink, and the requisite contact pressure for the dissipation of the heat loss is produced in conjunction with the assembly of the housing. No special retaining elements are needed. All the power components present on the printed circuit board are cooled in the manner according to the invention via the housing. When the housing is assembled, the particular contact pressure required can be produced by the choice of the type of fastening and by means of a suitable assembly process.
In addition, by means of a suitable embodiment of the copper layers in accordance with dependent claim 4, an increase in the effective surface area of both the copper layers on the printed circuit board and an improved dissipation of the heat loss at the connecting segments can be attained. The soldered connection between the two surfaces can easily be made during the solder immersion bath of the printed circuit board.
The novel features which are considered as characteristic for the present invention are set forth in particular in the appended claims. The invention itself, however, both as to its construction and its method of operation, together with additional objects and advantages thereof, will be best understood from the following description of specific embodiments when read in connection with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1, a section through a fastening of a power component on a printed circuit board;
FIG. 2, a section through an upper housing part in the form of a covering of the printed circuit board; and
FIGS. 3 and 4, a section through a schematic, enlarged detail of a connecting segment between the housing and the printed circuit board, before and after the assembly of the housing.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
In FIG. 1, a power component 1, for instance a power transistor, is secured to a printed circuit board 2. The electrical connections are made via soldered terminals 3, and a connection for carrying the lost heat onward is assured via an integrated metal plate that is permanently connected to a copper layer 5. The permanent connection can be made by soldering or for example by adhesive bonding, using a heat-conductive adhesive. The upper copper layer 5 is joined to a lower copper layer 7 via feed-through solder tags 6.
P
REFERENCES:
patent: 4115836 (1978-09-01), Hutchison
patent: 4259685 (1981-03-01), Romano
patent: 4339260 (1982-07-01), Johnson
patent: 4475145 (1984-10-01), Heil
patent: 4811165 (1989-03-01), Currver
patent: 5201866 (1993-04-01), Mok
patent: 5418685 (1995-05-01), Hussmann
Hussmann Dieter
Jares Peter
Jessberger Thomas
Weber Didier
Robert & Bosch GmbH
Striker Michael J.
Tolin Gerald
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