Device for welding a wire by means of thermo-compression bonding

Electric heating – Metal heating – For bonding with pressure

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Details

219 69M, 29178, B23K 2100

Patent

active

039506312

ABSTRACT:
A device for connecting a wire to a support, for example a semiconductor device, by means of thermocompression bonding, by buttwelding, has a movable tool for holding the wire while one end is exposed. An electrode is spaced from the wire end and means are provided for producing a high electric voltage between the electrode and the wire end so as to produce a spark discharge therebetween sufficient to melt the wire end and form a ball. The tool is then used to cause thermocompression bonding.

REFERENCES:
patent: 2587792 (1952-03-01), Van Sivers
patent: 2679570 (1954-05-01), Cisne
patent: 2759088 (1956-08-01), Lincoln
patent: 3643321 (1972-02-01), Field et al.

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