Device for treating silicon wafers

Details Device for treating silicon wafers Device for treating silicon wafers

2006-05-23

2006-05-23

Kackar, Ram N (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C156S345550, C156S345100, C156S345230, C505S166000, C310S090500, C118S715000

Reexamination Certificate

active

07048824

ABSTRACT:
A device (1) for treating objects, in particular silicon wafers (2), with a fluid (3), comprising a container (4) that holds the fluid (3); a rotatable carrying arrangement (5) for accommodation of the objects to be treated, which is disposed at least partially in the container (4); and a rotatably drivable shaft, which is run on at least one bearing (13, 14) and joined to the carrying arrangement (5); with the bearing (13, 14) including a first bearing member (22), which is joined to the shaft, and a second bearing member (24), which adjoins the first bearing member (22) and contains superconductive material; with the first bearing member (22) being kept spaced from the second bearing member (24) by magnetic forces.

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