Device for transferring lead frame

Conveyors: power-driven – With means to facilitate working – treating – or inspecting... – Means engaging conveyor or load on a conveyor to align load...

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198621, 1984681, 29759, 29827, B65G 2504

Patent

active

046243585

ABSTRACT:
In the case of the fabrication of semiconductor devices, lead frames are successively transferred to the bonding position where semiconductor chips are bonded to a lead frame. To this end, a lead frame transfer device has been used. According to the present invention, there are provided means for adjusting the distance between a pair of guide rails which define the lead frame transfer passage and means for varying the transfer stroke or pitch of a device for transferring a lead frame along the guide rails. The means for adjusting the distance between the pair of guide rails comprises gage holes and gages or lead screws and nut so that one of the pair of guide rails is moved toward or away from the other guide rail depending upon the width of a lead frame to be transferred. The means for varying the transfer stroke or pitch of a device for transferring a lead frame comprises cams and sensors, and varies them through rotating a screw shaft combined with a nut by a motor.

REFERENCES:
patent: 3726458 (1973-04-01), Rabl
patent: 4202092 (1980-05-01), Shibasaki et al.
patent: 4516673 (1985-05-01), Kashihara et al.
patent: 4524860 (1985-06-01), Misawa et al.
patent: 4540084 (1985-09-01), Curti
Japanese-language products catalogue (pp. 16 and 22).

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