Metal fusion bonding – Process – Using high frequency vibratory energy
Patent
1992-05-15
1993-08-31
Heinrich, Samuel M.
Metal fusion bonding
Process
Using high frequency vibratory energy
228 11, 219 8516, 219 8518, B23K 2010
Patent
active
052401669
ABSTRACT:
A single point bonding tool for use in ultrasonically bonding a fine or ultrafine wire to another electrical conductor, has a thin film resistor integrally formed thereon. The thin film resistor is integrally formed on the bonding tip by standard photolithographic techniques applied to the bonding tool. The tool combines ultrasonic energy and thermal energy provided by the resistor to provide required bonding energy that may be localized both in space and in time. The result offers optimized energy transfer to the selected workpieces and minimizes risk of damage to adjacent, heat sensitive devices.
REFERENCES:
patent: 3146141 (1964-08-01), Woodland
patent: 3454450 (1969-07-01), Tyrrell
patent: 3533155 (1970-10-01), Coucoulas
patent: 3614832 (1971-10-01), Chance et al.
patent: 3625783 (1971-12-01), Coucoulas
patent: 3711341 (1973-01-01), Joshi et al.
patent: 4040885 (1977-08-01), Hight et al.
patent: 4296309 (1981-10-01), Shinmi et al.
patent: 4315128 (1982-02-01), Matcovich et al.
patent: 4529115 (1985-07-01), Renshaw et al.
patent: 4534811 (1985-08-01), Ainslie et al.
patent: 4619397 (1986-10-01), Urban
patent: 4776509 (1988-10-01), Pitts et al.
patent: 4778097 (1988-10-01), Hauser
patent: 4842662 (1989-06-01), Jacobi
patent: 5019201 (1991-05-01), Yabu et al.
patent: 5044543 (1991-09-01), Yamazaki et al.
Fontana, Jr. Robert E.
Lane Linda H.
Yeack-Scranton Celia E.
Chang L. C.
Heinrich Samuel M.
International Business Machines - Corporation
Pintner J. C.
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