Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Patent
1976-09-22
1977-12-20
Van Horn, Charles E.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
228 1R, B23K 1904, B29C 2708
Patent
active
040639908
ABSTRACT:
A device for the ultrasonic welding of a tubular fitting having an annular flange in an opening of a thin-wall synthetic-resin foil container has an anvil supporting the fitting against the ultrasonic welding head. The anvil includes an upper anvil member and a lower anvil member. The upper anvil member has an upper surface confronting the head and formed in axial alignment with the head with a protuberance holding the foil away from this surface. The surface is provided with an annular groove receiving a first rubber ring registering with the head and supporting the flange of the fitting, the first rubber ring having an elasticity greater than that of the foil of said container. The lower member has a surface juxtaposed with said upper member and provided with an annular recess receiving a second rubber ring. The second rubber ring projects above the surface of said lower member.
REFERENCES:
patent: 3608809 (1971-09-01), Cushman
patent: 3612385 (1971-10-01), Humpage
patent: 3654041 (1972-04-01), Wysong
patent: 3947307 (1976-03-01), Buchscheidt
Buchscheidt Kurt
Rech Reiner
Volz Dieter
Elbatainer GmbH
Van Horn Charles E.
Wityshyn M. G.
LandOfFree
Device for the welding of an injection-molded spigot in a thin-w does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Device for the welding of an injection-molded spigot in a thin-w, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device for the welding of an injection-molded spigot in a thin-w will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-597766