Device for the mounting of very wide-band microwave integrated c

Details Device for the mounting of very wide-band microwave integrated c Device for the mounting of very wide-band microwave integrated c

1992-11-03

1994-05-24

Hearn, Brian E.

Metal working

Barrier layer or semiconductor device making

Barrier layer device making

29 2502, 437206, 437209, 437211, 437217, H01G 400

Patent

active

053136934

ABSTRACT:
The integrated circuit chips (5) are mounted on a ferrite support (20). The ferrite support is metallized uniformly (26) on its lower face and bears metallization zones (21, 24) on its other face. To certain of these zones (24) serving as a ground plane, there are attached the integrated circuit chips (5). The other zones (21) act as relays to connect the supply voltages that are applied by means of a linking wire (7') and a thin film decoupling capacitor (10, 11, 12) borne by the chip. The ground zones (24) are connected to the general ground plane (26) by metallized holes (25). The linking wire (7') is positioned so as to face a bared part of the ferrite to prevent any parasitic resonance.

REFERENCES:
patent: 5002895 (1991-03-01), LaParquier et al.
patent: 5023189 (1991-06-01), Bartlow
patent: 5063177 (1991-11-01), Geller et al.
patent: 5068714 (1991-11-01), Seipler
patent: 5200362 (1993-04-01), Lin et al.

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