Device for the controlled extraction of electronic circuit compo

Details Device for the controlled extraction of electronic circuit compo Device for the controlled extraction of electronic circuit compo

1983-07-05

1985-06-11

Goldberg, Howard N.

Metal working

Means to assemble or disassemble

Means to assemble electrical device

29758, 29764, H05K 1304

Patent

active

045219591

ABSTRACT:
The present invention describes an extraction device for removing components, such as leaded integrated circuit packages, from a printed circuit board to which their leads are soldered. The device, under operator control, is designed to captivate the component and to apply to it an extraction force which has a predetermined magnitude independent of the operator's judgment. Accordingly, when all of the component solder joints at the printed circuit board have been sufficiently reflowed, the device automatically withdraws the component from the board into itself. Damage to the board or the component as a result of the extraction process is virtually eliminated through the use of the device.

REFERENCES:
patent: 3699629 (1972-10-01), Hood, Jr. et al.

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