Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
Patent
1998-06-15
2000-11-28
Ryan, Patrick
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Solid flux or solid filler
228 33, 228 51, 228 52, 228 11, 228111, B23K 100
Patent
active
061523488
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to a device for the singled-out application of joining material deposits, particularly solder beads, from a joining material reservoir with an application device and a singling-out device for singling-out joining material deposits from the joining material reservoir.
BACKGROUND OF THE INVENTION
In the singular application of joining material deposits, also known by the term "single-point" process, the singling-out of the joining material deposits presented in a joining material reservoir has hitherto taken place by means of a singled-out uptake of the joining material deposits by means of the application device, which is operated after the fashion of a pick-and-place device. To do this it is necessary to convey the application device to the joining material reservoir, take a joining material deposit from it and then transfer it to the joint and place it there. On the basis of the above brief description of the known process it will be clear that the time required to apply a singled-out joining material deposit to a joint is substantially determined by the feed movements of the application device which are required for the singling-out of the joining material deposits. For obvious reasons, the known time-consuming application process for the application of singled-out joining material deposits is not suitable for commercial or industrial use.
BACKGROUND OF THE PRIOR ART
DE-A-4 320 055 discloses a device for the singled-out application of solder beads from a joining material reservoir with an application device and a singling-out device designed as a conveying device, which serves to convey solder beads singled-out from the joining material reservoir to the application device. This reference discloses a conveying device which is designed as a gravity conveying device.
U.S. Pat. No. 4,936,501 discloses a solder gun which serves to apply solder beads singled-out from a joining material reservoir in liquified state. To convey the solder beads singled-out from the joining material reservoir to the application device. This device is also provided with a gravity conveying device.
OBJECT OF THE INVENTION
The object of the present invention is to propose a device which enables a continuously and accurately timed the application of singled-out joining material deposits to be carried out.
BRIEF DESCRIPTION OF THE INVENTION
In the device according to the invention the singling-out device is designed as a circular conveying device device is designed as a circular conveying device, so that an arrangement of the transport uptake devices with a regular pitch is possible, which renders a pulsed operation of the application device possible.
In a preferred embodiment the singling-out device has transport uptake devices designed according to the size of the joining material deposits to be singled-out, which uptake devices are movable from an uptake position for the singled-out uptake of joining material deposits from the joining material reservoir into a discharge position for discharging the joining material deposits to the application device. By this means it is possible to feed the singled-out joining material deposits to the application device with a defined spacing from each other so that even if there is a fairly large distance between the joining material reservoir and the application device, the time required for transferring a joining material deposit to the application device is reduced to the time required to overcome the distance between two transport uptake devices.
The embodiment of the device described above is particularly advantageous if the singling-out device is designed as a circular conveying device, so that an arrangement of the transport uptake devices with a regular pitch is possible, which renders a pulsed operation of the application device possible.
If the singling-out device and the application device are combined in a structural unit, the device can be operated not only in a manner in which it is arranged in stationary fashion, where
REFERENCES:
patent: 1673281 (1928-06-01), Fay
patent: 4216894 (1980-08-01), Gleizes
patent: 4936501 (1990-06-01), Babarin
patent: 5467913 (1995-11-01), Namekawa et al.
patent: 5828031 (1998-10-01), Pattanaik
IBM Technical Disclosure Bulletin, vol. 32, No. 5a, Oct. 1989, New York US, pp. 332-335, XP000048936 "Solder Ring Placement for Multiple pin Electrical Connector".
Finn David
Rietzler Manfred
Elve M. Alexandra
Ryan Patrick
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