Device for the 3D encapsulation of semiconductor chips

Details Device for the 3D encapsulation of semiconductor chips Device for the 3D encapsulation of semiconductor chips

1993-03-08

1995-03-21

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257713, 361777, H05K 720

Patent

active

054002184

ABSTRACT:
Disclosed is a 3D encapsulation of semiconductor chips, each chip containing for example an integrated circuit, this encapsulation being aimed at optimising heat dissipation by conduction. Connection means are associated with each chip, making it possible to extend the pads of chips towards three sides of the chip, thus leaving the fourth side free. The chips are stacked on one another and then can be connected to heat dissipation means by their fourth side.

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