Device for testing semiconductor integrated circuits and method

Details Device for testing semiconductor integrated circuits and method Device for testing semiconductor integrated circuits and method

1990-03-09

1992-02-18

Wieder, Kenneth A.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324158P, G01R 3102

Patent

active

050897721

ABSTRACT:
Tests of a semiconductor IC is conducted first by bringing a plurality of conductive pattern circuits formed on an insulator sheet into contact with a plurality of bump electrodes formed on a substrate of the semiconductor, second by connecting a plurality of signal transmission pattern circuits formed on a transmission circuit substrate with each conductive pattern circuit of the insulator sheet, and then by connecting the transmission circuit substrate with a body of the testing device. A probing test can be simplified since there is no need to manually adjust positions of conventional probe needles. Further, semiconductor ICs having a lot of bump electrodes can be test without being damaged.

REFERENCES:
patent: 4733172 (1988-03-01), Smolley
patent: 4820976 (1989-04-01), Brown
patent: 4849689 (1989-07-01), Gleason et al.
patent: 4906920 (1990-03-01), Huff et al.
patent: 4912399 (1990-03-01), Greub et al.

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