Device for testing adhesive bonds

Measuring and testing – Coating material: ink adhesive and/or plastic

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Details

73842, 374 45, G01N 324

Patent

active

051760282

ABSTRACT:
An adhesive is applied to overlapping portions of a two-part test sample located between opposing press heads of the bond testing device. The press heads then press together the overlapping portions for a specific period of time while heating the test sample to a preselected temperature. The device precisely maintains the temperature while bonding the sample at a preselected pressure. A load cell measures the shear force required to separate the bonded test piece.

REFERENCES:
patent: 2982129 (1961-05-01), Wetzel et al.
patent: 2989865 (1961-06-01), Belfour
patent: 3412606 (1968-11-01), Cooper et al.
patent: 3850033 (1974-11-01), Schmitt
patent: 4253901 (1981-03-01), Aslakson
patent: 4856342 (1989-08-01), Bottenbruch et al.
patent: 4893513 (1990-01-01), Schroeder et al.
patent: 4957004 (1990-09-01), McKinlay et al.
"A Technique to Evaluate the Bonding Reactivity of Thermosetting Adhesives," P. E. Humphrey, D. Zavala, pp. 323-328, Nov. 7, 1989.

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