Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2005-04-26
2005-04-26
Nguyen, Vinh P. (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S765010
Reexamination Certificate
active
06885206
ABSTRACT:
A device for supporting and securing thin wafers comprising a housing having an upper shelf extending radially inwardly from the housing and a lower shelf extending radially inwardly from the upper shelf. An upper seal is disposed within the upper shelf and an inspection windowpane is disposed within the lower shelf. A vacuum is provided between the inspection windowpane and the upper seal to secure the wafer to the inspection windowpane and to secure the inspection windowpane to the housing. A ring-shaped frame assembly may further support and secure the wafer.
REFERENCES:
patent: 3729206 (1973-04-01), Cachon et al.
patent: 3990689 (1976-11-01), Eklund, Sr.
patent: 4037830 (1977-07-01), Poluzzi et al.
patent: 4131267 (1978-12-01), Ono et al.
patent: 4182265 (1980-01-01), Bracher
patent: 5133140 (1992-07-01), Frey
patent: 5703493 (1997-12-01), Weeks et al.
patent: 5707051 (1998-01-01), Tsuji
patent: 5794372 (1998-08-01), Grana
patent: 6187134 (2001-02-01), Chow et al.
patent: 6317647 (2001-11-01), Akaike et al.
patent: 6379235 (2002-04-01), Halley
patent: 6454865 (2002-09-01), Goodman et al.
Hurley et al.,The Dynamics of Backside Wafer-Level Emission Microscopy, Electronics Engineer, Jan. 1998.
Crockett K. David
Crockett & Crockett
Nguyen Vinh P.
Strasbaugh
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