Device for sticking protective sheet on substrate surface

Details Device for sticking protective sheet on substrate surface Device for sticking protective sheet on substrate surface

2005-11-08

2005-11-08

Gray, Linda (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With cutting, punching, piercing, severing, or tearing

C156S522000, C156S527000, C156S530000, C156S251000, C029S025010

Reexamination Certificate

active

06962185

ABSTRACT:
The device for sticking a protective sheet on the substrate surface according to the present invention comprises a sticking unit for sticking a surface protective sheet on a semiconductor wafer, and a thermocompression and cutting unit which conducts thermocompression bonding for the periphery of the semiconductor wafer and cuts the surface protective sheet along the edge of the semiconductor wafer.

REFERENCES:
patent: 6080263 (2000-06-01), Saito et al.
patent: 60-231328 (1985-11-01), None
patent: 8-148452 (1996-06-01), None
patent: 2000-38556 (2000-02-01), None

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