Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1984-05-22
1986-07-29
Ramsey, Kenneth J.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228 43, 228 561, B23K 106, B23K 306
Patent
active
046027300
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to a soldering device for soldering on a printed substrate and, particularly, pertains to a device for soldering chip form parts such as resistances and condensers, which have no leads carried on a printed substrate, on printed conductor portions of the substrate at opposite end electrodes thereof.
BACKGROUND ART
A soldering device for chip parts which has been available is a jetting soldering device adapted to make soldering by jetting up molten solder onto the surface to be soldered. FIG. 1 shows the commonest wave form of the jetted solder.
This soldering device involves the following problem:
As shown in FIG. 1, the solder wave 2 is being produced from a nozzle 1, while the printed substrate 4 carrying chip parts 3 is moving from left to right, as seen in this figure, but the solder wave 2 cannot enter into a space formed between the chip part 5 and the chip part 6, giving rise to a phenomenon (hereinafter called solderlessness) that no solder can be put on the electrodes 7 and 8 on the chip parts 5 and 6. Since the solder wave 2 can enter into the space between the chip parts 6 and 9 which are widely distanced from one another, solder will be deposited on their respective electrodes 10 and 11, forming solder paddings 12 and 13 on the circuit electrodes printed on the substrate 4. To correct the solderlessness which would develop in narrow spaces between chip parts, it is imperative to provide the solder paddings by manual operation, and local heating by the soldering iron used for the retouching has inflicted damage on these chip parts.
SUMMARY OF THE INVENTION
The present invention provides a printed substrate soldering device characterized by a contrivance by which vibrations are given to the printed substrate, as it passes through the aforementioned solder wave in the printed substrate soldering device. The device is equipped with a solder tank accommodating molten solder and a nozzle for producing a jetting of molten solder in the aforementioned solder tank, and which is adapted to make soldering on the printed substrate, while moving said substrate through the aforementioned jetted solder wave.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic view of the conventional soldering device;
FIG. 2 is a side view of the principal portion of the printed substrate, showing the solderlessness in the conventional soldering device;
FIG. 3 is a side view showing the major arrangement of a soldering device embodying this invention;
FIG. 4 is a front view of the principal portion of the arrangement shown in FIG. 3;
FIG. 5 is a side view of the principal part of the printed substrate on which soldering has been made by use of this device;
FIG. 6 is a plan view of the major arrangement of another soldering device embodying this invention; and
FIG. 7 is a front view of the principal portion of the arrangement shown in FIG. 6.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present invention will become more apparent from the following detailed description taken in connection with the accompanying drawings:
In the embodiment illustrated in FIG. 3, the solder wave 15 flows out of nozzle 14a inside the solder tank 14, while the printed substrate carrying chip parts 16 thereon is moving from left to right. On the other hand, upward of the printed substrate 17, there is provided a vibration imparting means in which an offset cam plate 18 turns and, then, the rod 21 which is normally being pulled upward by a spring 20 held in place on the fixed plate 19, is set to make up-down reciprocations through a roller 21a. The up-down motion of the rod 21 will be transmitted to the printed substrate 17 through a roller 24 which is normally in contact with the upper surface 23 of the printed substrate 17; as a result, the printed substrate 17 which is supported by a printed substrate conveying means 25 will be vertically vibrated. On the printed substrate 17 being vibrated in this way, the solder wave 15 will become more apt to enter into narrow spaces
REFERENCES:
patent: 3303983 (1967-02-01), Patrick et al.
patent: 3993236 (1976-11-01), Antonevich
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4465219 (1984-08-01), Kondo
Matsuda Chuichi
Matsumae Tatsuya
Mori Mikio
Murakami Shuichi
Yamashita Kenichi
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